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다온테마
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  • 사업분야
  • Probe&PackageTest
  • 사업분야

    홈페이지를 방문해주셔서 감사합니다.

    Probe(Wafer) Test

    6, 8 & 12” Wafers and Bumped Wafers

    Particle 관리(Class 1K)

    Final(Package) Test

    PBGA,FBGA,LGA,QFN,QFP,Flip Chip and Others

    Customized special Package moudle

    Pick & Place(수평) Handler,Bowl feeder(Turret) Handler and Vertical(수직) Handler

    Other Service

    - Wafer UV Eraser

    - Auto visual Inspections(Lead/ball/marking)

    - Tape & Reel (Auto/Manual)

    - Unit(Manual) Marking

    - Drop Shipping

    - Application fileld test