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다온테마
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  • 사업분야
  • Assembly
  • 사업분야

    홈페이지를 방문해주셔서 감사합니다.

    Assembly Total Solution

    1) Assembly(Sample) INHOUSE 운영

    - OPEN(Air) Cavity Plastic PKG

    - PKG Type

    QFN PKG : 3x3( 10,12,16lead) 4x4 (12, 16, 20, 24 ld) 5x5 (16,20,24,28,32lead) 6x6(24,28,36,40lead)     7x7(28,32,44,48 Lead) 8x8(28,32,52,56 Lead) 9x9(64 Lead) 12x12(80 Lead) 12x12(100 Lead) LQFP PKG : 7x7(48lead), 10x10(44,52,64lead) SOP PKG :150mil(8,14,16 Lead),300mil(16,20,24,28Lead),Heat Enhanced PKG Others PKG: Ceramic PKG,CLCC,PGA etc COB(Chip On Board) Assembly (WIRE BONDER 및 CAPABILTY : K&S MAXUM ULTRA FINE PAD PITCH 45um까지 대응)

    2) Assembly Outsourcing

    - 국내 ASS'Y Site 지원 PKG : FBGA, PBGA , FC FBGA, LGA, QFP, WLCSP,Moudle Wafer Bumping (GOLD, SOLDER, CU PILLAR )

    - 해외 ASS'Y Site 지원

    PKG : QFP, QFN, SOP류, TSSOP, LGA, DIP, SOT etc..

    - Wafer Back Grinding(B/G) & SAW B/G Wafer : 6" 8" 12"INCH (MPW Wafer 포함) SAW는 모든 Wafer 가능 (CHIP 단위 SAW & MPW Wafer Saw) Chip Sorting (Gel Pack or Waffle Pack) 가능

    3) Others (Assemlby Service)

    - Wire Bonding Diagram Design

    - Substrate(PCB) Design & Artwork

    - Unit Laser Marking( Remarking & Add Marking)

    - PKG 불량 분석 지원 서비스 (X-RAY, DECAP, PHOTO, etc)